Week In Review: Automatic, Security, Pervasional Computing

Suzuki will cooperate with SkyDrive on flying cars. SkyDrive is working on a taxi service that it wants to launch at the 2025 World’s Fair in Osaka, Japan.

Reminds me: The car company Teslo you remember 947 vehicles in the United States because a rear view image is delayed and is not displayed as soon as the car is reversed, said the National Highway Traffic Safety Administration (NHTSA). . Mercedes-Benz USA you remember some 2010 vehicles in which various control units may have been upgraded with incorrect software configuration during service repair, says the NHTSA. The software caused system failures, including loss of drive power, reduced external light, or loss of dynamic control functions, including stability and traction control.

Lidar: Automotive company Luminar get Freedom Photonics, a manufacturer of high-performance laser chips. Luminar will work with Freedom Photonics on lidar systems. “Component-level innovation and integration are critical to our performance, cost, and continued leadership in automotive technology. Bringing Freedom Photonics to Luminar enables a new level of economies of scale, deepens our competitive gap, and strengthens our future technology roadmap,” said co-founder Jason Eichenholz. and CTO at Luminar. “We have worked closely with the Freedom team for the past several years. They have proven to be the best in the world for innovative semiconductor laser chip technology, where both power and radio quality are needed at the same time for true high-resolution long-distance. “

EV charging: New CoolSiC 650 V silicon carbide (SiC) MOSFET from Infineon Technologies uses SiC trench technology improve power performance in high-power applications, including servers, telecommunications, industrial SMPS, fast EV charging, motor drives, solar power systems, power storage and battery reforming. The devices improve shifting behavior at higher currents and lower reverse recovery load. They come in a D 2PAK SMD 7-pin package with .XT interconnect technology.

Invasive computing
IoT: STMicroelectronics‘VIPerGaN50 for single-shift airborne converters up to 50 Watts uses a 650V gallium nitride (GaN) power transistor, which helps electrical efficiency in small packages for smart meters and home appliances. Consumers and industry designers can use GaN broadband-bandgap technology to meet ecodesign codes.

High performance computing: Aimed to market exascale or at least more accessible to major HPC and AI customers, AMD announced that it had expanded its Instinct ecosystem with accelerator in PCIe format. The newest accelerator in the MI200 family, the MI210 accelerator puts the AMD CDNA 2 Architecture with 64 GB of HBM2e GPU memory, 104 computing units, 181 TFLOP amount of semi-precision (FP16) performance and 1700 MHz peak motor clock, among other specifications, in the offers the PCIe format. The Lumi supercomputer team used the MI210 to prepare scientists for the Lumi supercomputer, which uses AMD EPYC processors and AMD Instinct MI200 accelerators. “We used AMD Instinct MI210 accelerators to gain hands-on experience with the Instinct MI200 family, preparing our scientists to deal with the many difficult and complex projects that will work after Lumi is fully deployed,” said Pekka Manninen, Director of LUMI Leadership. and Computer Installation, CSC. In addition to the MI210 accelerator, AMD has added more commercial ISVs – inclusive Ansys, Cascading Technologiesand TempoQuest. The ISVs provide specific applications to accelerated workloads in simulations, such as computer fluid dynamics (CFD), weather forecasting, and computer-aided engineering (CAE). AMD has also added more partner support and accelerated its accelerator applications and library in its ROCm 5 software. The Instinct ecosystem is now supported ASUS, Dell Technologies, Gigabyte, HPE, Lenovoand Supermicro now.

Cloud, data center: More hyperscale data centers are growing, according to Synergy Research Group, which sets the number at 314 planned hyperscale data centers. More than 1,000 hyperscale data centers now exist, with nearly 40% in the United States. The United States, according to the report, has half of the global capacity and the most planned hyperscale data centers in the pipeline, followed by China, Ireland, India, Spain, Israel, Canada, Italy, Australia and the United Kingdom. .NVIDIA introduced its Grace CPU Superchip, a discrete data center CPU based on its Arm Neoverse. The chip has 144 high-performance cores and 1 terabyte / second memory … AMD announced its data center CPU with 3D stacking of dice – is the 3rdrd generation EPYC processors with AMD 3D V-Cache technology. Coded Milan-X, the 3rd gen EPYC delivers up to 66 percent performance increase across various targeted technical computing workloads versus the comparable, non-stacked 3rd gen AMD EPYC processors, said AMD in a press release. The EPYC processors use an L3 cache of Micron, Ansys Cloud now offers automatic access to AMDs 3rd gen EPYC processors with AMD 3D V-Cache technology as part of its computer engineering (CAE) workflows on the new Microsoft Azure HBv3 virtual machines (VM). AMD reports that in the early testing of Azure, Microsoft saw up to an 80% improvement in large-scale computational fluid dynamics (CFD) simulations and up to a 50% improvement in explicit finite element analysis (FEA) crash tests. ⁇ Keysight delivered 800G test solution to validate that 112 Gbps serial data center interfaces conform to industry standards. The solution includes Keysight’s M8040A 64 GBaud high-performance error rate tester (BERT) with N1060A Digital Communication Analyzer (DCA) for receiving testing and Keysight’s Infiniium UXR-Series real-time oscilloscope for transmitter testing. Automated test software also verifies that a receiver complies with IEEE 802.3ck specifications (M8091CKPA), transmitters comply with IEEE 802.3ck specifications (N1091CKCA and D90103CKC), and transmitters comply with OIF-CEI-112G PAM4 specifications (N DAM10).

Cloud avoidance (edge ​​computing): A neuromorphic chip that is used federal learning to accelerate a spiky neural network (SNN) so that data can be processed locally away from data centers were developed by Fraunhofer IIS. Eleven Fraunhofer institutes are involved in the SEC-Learn (Sensor Edge Cloud for Federated Learning) project. The chip is in production now.

Cloud to manufacturers: GlobalFoundries qualified Cadence‘s digital solution enabled AWS (Amazon Web Services) for GF’s 22FDX platform. Cadence reports that the memory designer Xenergic used the Cadence Cloud Passport to tape a test piece with a Tensilica Fusion F1 DSP and low-power memories on the GF 22FDX platform.

In a blog, Synopsiswonder if 2022 is the year the EDA is really moving towards the cloud.

Space computing: STMicroelectronics announced 2.5V wheel-to-hard digital-to-analog converter (DAC) for satellites. The RHRDAC121 DAC is a 12-bit 1Msps consecutive approximate register (SAR) DAC that consumes 0.6mW at its maximum speed and supply voltage. Uses are in circuits for telemetry, management, and precision sensor-gain adjustment. The DAC has an SPI-compatible serial output, an internal voltage reference, and an automatic power-on-reset to zero-voltage output that helps reduce circuitry because it has higher accuracy and minimal external components.

La Lapsus $ A hacker group says it hacked Octave – a two-factor authentic company protecting access to internal systems of many customers. Also Samsung, NVIDIAand Verizon, among others, were hacked, the group said. … .Last week, the U.S. Cybersecurity and Infrastructure Security Agency (CISA) and the Federal Research Agency (FBI) warned of potential threats to U.S. and international satellite communications (SATCOM) networks.

Security: Wind turbine company Clothes used Ansys EXPIRES model-based software development environment to help design The controller of Vestas’ wind turbine control system. The SCADE helped Vestas demonstrate that its complex sensor fusion in its controller complied with safety standards. Vestas did not use third-party programmable logic controllers (PLCs).

People, companies
That of Lam Research president and CEO Tim Archer testified before the U.S. Senate Commerce Committee on Trade, Science, and Transportation to support the CHIPS law and research that may be conducted through the National Laboratories and offered support for a National Semiconductor Technology Center.

Read more news at Manufacturing, Test and Design, Low Power.

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